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Site  |
Tool Name  |
Tool ID  |
Tool Mfg |
Tool Model | Tool Area |
Tool Desc |
Tool Comment |
| Cornell |
GSI Plasma CVD PECVD |
CNF 0303 |
GSI |
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Thin film Deposition and Growth |
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Whole Wafers Only |
| Cornell |
GSI single wafer PECVD |
CNF 0303 |
GSI Group Sciences |
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Thin film Deposition and Growth |
full wafer single wafer PECVD of silicon based films on silicon. Poly, oxide, n |
Clean "silicon" materials only |
| Cornell |
IPE Plasma CVD PECVD |
CNF 0304 |
Ion Plasma Equipment |
1000 |
Thin film Deposition and Growth |
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| Harvard U. |
Nexx PECVD |
CVD 2 |
Nexx Systems |
Cirrus 150 |
Thin film Deposition and Growth |
NEXX CVD-2 is an ECR (electron cyclotron resonance) plasma-enhanced CVD system. |
6" Chuck, Loadlock, RF, Microwave, Heat/Cool, Oxide, nitride |
| Harvard U. |
STS PECVD |
CVD 3 |
STS |
LPX PECVD |
Thin film Deposition and Growth |
Deposition temperature up to: 400C. This system has a low frequency generator. |
6", Oxide, Nitride, Amorphous (doped/undoped) |
| Georgia Tech |
Astex ECR PECVD |
GT 103 |
Astex |
AX 3060-1 |
Thin film Deposition and Growth |
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Diamond-like Carbon, Low Temperature Oxide / Nitride PECVD |
| Georgia Tech |
Plasma-Therm PECVD |
GT 163 |
Plasma Therm |
Wafr/Batch 790 Series |
Thin film Deposition and Growth |
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| Georgia Tech |
STS PECVD |
GT 179 |
STS |
Multiplex CVD |
Thin film Deposition and Growth |
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| Georgia Tech |
Unaxis PECVD |
GT 193 |
Unaxis |
Unaxis 78324 |
Thin film Deposition and Growth |
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| Georgia Tech |
STS PECVD 2 |
GT 220 |
STS |
PECVD |
Thin film Deposition and Growth |
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| Penn State U. |
AMAT Cluster Tool PECVD Chamber #1 |
PSU 016 |
Applied Materials |
P-5000 |
Thin film Deposition and Growth |
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Liquid Precursors |
| Penn State U. |
AMAT Cluster Tool PECVD Chamber #2 |
PSU 017 |
Applied Materials |
P-5000 |
Thin film Deposition and Growth |
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Silicon OxyNitride Chamber |
| Penn State U. |
Trion HDP PECVD |
PSU 018 |
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Thin film Deposition and Growth |
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| Stanford |
STS PECVD System |
SNF sts |
STS |
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Thin film Deposition and Growth |
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| U. C. Santa Barbara |
PECVD |
UCSB 208 |
PlasmaTherm |
790 |
Thin film Deposition and Growth |
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SiO2 and SiNx dep |
| U. C. Santa Barbara |
ICP Deposition PECVD |
UCSB 211 |
Unaxis |
VLR |
Thin film Deposition and Growth |
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SiO2 and SiNx ICP PECVD |
| U. Michigan |
GSI PECVD |
UMI 400 |
GSI |
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Thin film Deposition and Growth |
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| U. Michigan |
PT790 - PECVD chamber |
UMI 411 |
PlasmaTherm |
790 |
Thin film Deposition and Growth |
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PECVD of a-Si:H, SiO2, Si3N4, SiC |
| U. Minnesota |
pecvd |
UMN 900047 |
Plasmatherm |
model 340 |
Thin film Deposition and Growth |
Plasma-enhanced chemical vapor deposition of poly silicon, silicon nitride and s |
Wafer sizes to 200mm (qty 1), 350C max temp, also used for ammonia flood for image reversal process |
| U. Texas Austin |
790 Plasmatherm #1 PECVD |
UT 790 Plasmatherm #1 |
Plasmatherm |
790-6" |
Thin film Deposition and Growth |
SiO2, SiN, aSi deposition
Maximum process temperature 300C |
PECVD chamber
Up to 6" wafer
CF4-8%O2 to perform in-situ cleaning |
Site  |
Tool Name  |
Tool ID  |
Tool Mfg |
Tool Model | Tool Area |
Tool Desc |
Tool Comment |