National Nanotechnology Infrastructure Network

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Process Blogs containing FlexAl

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New ALD Processes at Cornell on the Oxford FlexAl

10.15.12

Vincent Genova, CNF Process Engineer
Posted October 2012

Since CNF’s purchase of an Oxford Instruments FlexAL ALD system in 2008, we have continued to develop new thin film processes, both on our own and cooperatively with Oxford.  Our ALD system has both thermal and plasma enhanced (PEALD) deposition capability for materials derived from hafnium (Hf), aluminum (Al), tantalum (Ta), and silicon (Si) based organometallic and organosilane precursors.  In addition...

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