Process Blogs containing FlexAl
New ALD Processes at Cornell on the Oxford FlexAl
Vincent Genova, CNF Process Engineer Since CNF’s purchase of an Oxford Instruments FlexAL ALD system in 2008, we have continued to develop new thin film processes, both on our own and cooperatively with Oxford. Our ALD system has both thermal and plasma enhanced (PEALD) deposition capability for materials derived from hafnium (Hf), aluminum (Al), tantalum (Ta), and silicon (Si) based organometallic and organosilane precursors. In addition...
Posted October 2012
