Process Blogs containing High Aspect Ratio
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High aspect ratio etching of sub 100 nm structures in dielectrics
10.15.12
Significant Upgrade to the Oxford PlasmaLab 100 at Cornell for Nanoscale Dielectric Etching Enables Improved Etching of High Aspect Ratio Dielectric Structures
Vincent Genova, CNF Process Engineer Earlier this year, a substantial upgrade to the Oxford 100 ICP etch system at Cornell was completed. This upgrade includes the installation of a large 12 gas pod, a gas ring manifold, and the latest version of the PLC. The installation of a...
Posted October 2012
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