National Nanotechnology Infrastructure Network

National Nanotechnology Infrastructure Network

Serving Nanoscale Science, Engineering & Technology

Process Blogs containing MEMS

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Primaxx Vapor HF Release for Oxide MEMS Structures at Cornell

10.15.12

Vincent Genova, CNF Process Engineer
Posted Oct. 2012

The recently installed Primaxx uEtch vapor HF system is a valuable addition to CNF’s process capabilties.  The system provides a single step release process of MEMS structures without stiction or the use of critical point drying.  The dry release process allows for highly selective and uniform etching of silicon dioxide (SiO2).  Undercut etch rates as high as 0.25um/min can be obtained along with high...

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High aspect ratio etching of sub 100 nm structures in dielectrics

10.15.12

Significant Upgrade to the Oxford PlasmaLab 100 at Cornell for Nanoscale Dielectric Etching Enables Improved Etching of High Aspect Ratio Dielectric Structures

Vincent Genova, CNF Process Engineer
Posted October 2012

Earlier this year, a substantial upgrade to the Oxford 100 ICP etch system at Cornell was completed.  This upgrade includes the installation of a large 12 gas pod, a gas ring manifold, and the latest version of the PLC.  The installation of a...

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