Process Blogs containing Oxford
New ALD Processes at Cornell on the Oxford FlexAl
Vincent Genova, CNF Process Engineer Since CNF’s purchase of an Oxford Instruments FlexAL ALD system in 2008, we have continued to develop new thin film processes, both on our own and cooperatively with Oxford. Our ALD system has both thermal and plasma enhanced (PEALD) deposition capability for materials derived from hafnium (Hf), aluminum (Al), tantalum (Ta), and silicon (Si) based organometallic and organosilane precursors. In addition...
Posted October 2012
High aspect ratio etching of sub 100 nm structures in dielectrics
Significant Upgrade to the Oxford PlasmaLab 100 at Cornell for Nanoscale Dielectric Etching Enables Improved Etching of High Aspect Ratio Dielectric Structures
Vincent Genova, CNF Process Engineer Earlier this year, a substantial upgrade to the Oxford 100 ICP etch system at Cornell was completed. This upgrade includes the installation of a large 12 gas pod, a gas ring manifold, and the latest version of the PLC. The installation of a...
Posted October 2012