Process Blogs containing Reactive Ion Etch
DRIE on Si and Dielectrics at Michigan Lurie Nanofabrication Facility
Kevin Owen , University of Michigan With the recent expansion at the LNF, three new SPTS ICP systems were installed: two Pegasus deep silicon etchers and one APS system, designed for deep glass and dielectric etching. These tools have pushed the limits of high aspect ratio plasma etching. The first part of this paper covers deep silicon etching using the SPTS Pegasus tool, including standard process capabilities as well as two novel...
Posted January 2013
