Process Blogs containing Vapor HF
Primaxx Vapor HF Release for Oxide MEMS Structures at Cornell
Vincent Genova, CNF Process Engineer The recently installed Primaxx uEtch vapor HF system is a valuable addition to CNF’s process capabilties. The system provides a single step release process of MEMS structures without stiction or the use of critical point drying. The dry release process allows for highly selective and uniform etching of silicon dioxide (SiO2). Undercut etch rates as high as 0.25um/min can be obtained along with high...
Posted Oct. 2012
