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Process Blogs containing Vapor HF

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Primaxx Vapor HF Release for Oxide MEMS Structures at Cornell


Vincent Genova, CNF Process Engineer
Posted Oct. 2012

The recently installed Primaxx uEtch vapor HF system is a valuable addition to CNF’s process capabilties.  The system provides a single step release process of MEMS structures without stiction or the use of critical point drying.  The dry release process allows for highly selective and uniform etching of silicon dioxide (SiO2).  Undercut etch rates as high as 0.25um/min can be obtained along with high...

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