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High aspect ratio etching of sub 100 nm structures in dielectrics

10.15.12

Significant Upgrade to the Oxford PlasmaLab 100 at Cornell for Nanoscale Dielectric Etching Enables Improved Etching of High Aspect Ratio Dielectric Structures

Vincent Genova, CNF Process Engineer
Posted October 2012

Earlier this year, a substantial upgrade to the Oxford 100 ICP etch system at Cornell was completed.  This upgrade includes the installation of a large 12 gas pod, a gas ring manifold, and the latest version of the PLC.  The installation of a...

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