Process Blogs containing nanonex
Photocurable Nanoimprint (P-NIL) Process for Patterning Nitride and Oxide (Cornell)
Vincent Genova, Process Engineer, Cornell The recently established photocurable nanoimprint (P-NIL) process has been demonstrated with pattern transfer into silicon oxide and silicon nitride using an internally fabricated ASML DUV (248nm) patterned quartz template. The P-NIL process utilizes a bilayer resist system in which the first resist layer (200nm) is purely organic, while the upper UV resist layer (90nm) contains silicon. After...
Posted Dec. 2012
Nanonex NX-2500 Nanoimprint Lithography Update (Cornell)
Vincent Genova, Process Engineer, CNF Nanoimprint lithography (NIL) has the advantage of high throughput with sub-10nm resolution. NIL is included on the ITRS roadmap for 45nm and below nodes for advanced electronic devices. In addition to electronics, NIL is a benefit to many applications including displays, nanophotonics, biotechnology, and MEMS. The NX-2500 has both thermal imprint (T-NIL) and photocurable imprint (P-NIL)...
Posted Oct. 2012