National Nanotechnology Infrastructure Network

National Nanotechnology Infrastructure Network

Serving Nanoscale Science, Engineering & Technology

NNIN Etch Workshop Summary and NNIN Dry Etch Capabilities

Vince Genova

Cornell NanoScale Science and Technology Facility

A NNIN Etch Workshop for NNIN Staff was held at Cornell University on May 21-22, 2013.  This was the third NNIN etch workshop held at Cornell since 2006.  Etch personnel from every NNIN site attended and presented information on their current etch capabilities, along with current process results.   Equipment details such as current gas chemistries, wafer sizes, temperature ranges and many others were noted as well.   Materials compatibilities, restrictions, and chamber conditioning methods were discussed.  An outcome of the workshop is the creation of database of etch equipment and capabilities throughout the network.  This is an invaluable resource for the technical staff, user managers, and users of NNIN facilities.  It demonstrates how well the sites complement each other with regard to the many etch requests and requirements that we need to address.

The second day of the workshop featured presentations on more advanced etch topics and included:

  • Silicon based dielectric etching: A comparison of chemistries-V. Genova of Cornell University
  • Silicon nanowire etching-Ling Xie of Harvard University
  • Dry etching of III-V and silicon materials-Ning Cao of UCSB
  • Deep Glass Etching-Kevin Owen of the University of Michigan

A great amount of knowledge and information was shared and many issues were addressed.  The workshop was a great success based on the feedback of the attendees.  Presentations are accessible on the NNIN site http://nnin.org/nnin-etch-workshop.

A database of all NNIN etch capabilities was developed. It is available here in spreadsheet form /sites/default/files/files/NNIN_etch_capabilities_june_2013.xlsx.  For additional information about a specific tool/recipe please contact the appropriate NNIN Site directly.

Attendees:

  • Andy Lingley       University of Washington
  • Dave Botsch       Cornell NanoScale Facility
  • Ed Camacho, Cornell NanoScale Facility
  • Garry Bordonaro, Cornell NanoScale Facility
  • Guixiong Zhong,  Harvard University
  • Guy Lavallee, The Pennsylvania State University
  • Hang Chen, Ph.D. ,Georgia Institute of Technology
  • Jon Martin, Arizona State University
  • Kevin Owen,University of Michigan, Ann Arbor
  • Ling Xie, Harvard University
  • Mary Tang, Stanford University
  • Meredith Metzler, Cornell NanoScale Facility
  • Michael Skvarla,  Cornell NanoScale Facility
  • Nathan Reed,Washington University in St. Louis
  • Ning Cao,  University of California, Santa Barbara
  • Ricardo Garcia ,University of Texas at Austin
  • Robert Hower, Ph.D.,University of Michigan, Ann Arbor
  • Shane Miller  ,The Pennsylvania State University
  • Thomas Johnson-Averette ,   Georgia Institute of Technology
  • Tomoko Borsa  , University of Colorado at Boulder
  • Tony Whipple ,    University of Minnesota
  • Vince Genova  ,   Cornell NanoScale Facility
Tags: 
RIE
etch
Reactive Ion Etch

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