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Process Versatility of FEI's Quanta 3D Dual-Beam FIB

Kevin Roberts, Scientist, University of Minnesota
Posted January 2013

Fig. 1.  NFC's FEI Quanta 200 3D Dual-Beam FIB

The Quanta 200 3D is a Dual-Beam system (fitted with both an E-beam and an Ion Beam) comprised of a tungsten electron column and a Ga ion column that utilizes either high vacuum or environmental SEM (ESEM) technology to section, image, and analyze a wide range of conducting and non-conducting samples. This system offers the capability for in-situ dynamic experiments, 3D imaging and analysis, and transmission electron microscope (TEM) sample preparation for more in-depth analysis. See figure 1.

Since receiving the Quanta 200 3D in the spring of 2005, it has shown its usefulness in a variety of projects. Not surprisingly, it has shown great utility in the standard FIB applications such as circuit editing, cross-sectioning,  and TEM lamella preparation. See figures 2 and 3.

 
Fig. 2  Circuit Edit performed at NFC   Fig. 3  Fe-MgO TEM Image, prepared using NFC's FIB.

In addition to the standard applications of a FIB, many novel approaches have been developed over the years for its use in direct-write prototyping of novel surface features on a wide variety of materials. Of particular importance at NFC has been the FIB's capability to produce plasmonic structures for bio-detection schemes, and miniaturized optical diffraction gratings. The following figures highlight just some of these examples.

Fig. 4.  A silver pyramid with integrated gratings. The gratings were patterned into a KOH-etched silicon mold via FIB and the mold was then used for template stripping. Reprinted with permission from Lindquist et al, copyright 2010, American Chemical Society.

 


Fig. 5.  FIB is used to create silicon template, then thin film metal is removed. Lindquist et al, 2010.

 

 

 

Fig. 6 and 7. Gray-scale etched 3-dimensional diffraction grating on GRIN lens fiber.

 

 

Tags: 
FIB
Minnesota

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