Process Versatility of FEI's Quanta 3D Dual-Beam FIB
Kevin Roberts, Scientist, University of Minnesota
Posted January 2013
|Fig. 1. NFC's FEI Quanta 200 3D Dual-Beam FIB|
The Quanta 200 3D is a Dual-Beam system (fitted with both an E-beam and an Ion Beam) comprised of a tungsten electron column and a Ga ion column that utilizes either high vacuum or environmental SEM (ESEM) technology to section, image, and analyze a wide range of conducting and non-conducting samples. This system offers the capability for in-situ dynamic experiments, 3D imaging and analysis, and transmission electron microscope (TEM) sample preparation for more in-depth analysis. See figure 1.
Since receiving the Quanta 200 3D in the spring of 2005, it has shown its usefulness in a variety of projects. Not surprisingly, it has shown great utility in the standard FIB applications such as circuit editing, cross-sectioning, and TEM lamella preparation. See figures 2 and 3.
|Fig. 2 Circuit Edit performed at NFC||Fig. 3 Fe-MgO TEM Image, prepared using NFC's FIB.|
In addition to the standard applications of a FIB, many novel approaches have been developed over the years for its use in direct-write prototyping of novel surface features on a wide variety of materials. Of particular importance at NFC has been the FIB's capability to produce plasmonic structures for bio-detection schemes, and miniaturized optical diffraction gratings. The following figures highlight just some of these examples.
|Fig. 4. A silver pyramid with integrated gratings. The gratings were patterned into a KOH-etched silicon mold via FIB and the mold was then used for template stripping. Reprinted with permission from Lindquist et al, copyright 2010, American Chemical Society.|
|Fig. 6 and 7. Gray-scale etched 3-dimensional diffraction grating on GRIN lens fiber.|