National Nanotechnology Infrastructure Network

National Nanotechnology Infrastructure Network

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Wafer Level AlGe Eutectic Bonding for MEMS-Electronic-Photonic Heterogeneous Integration

Niels Quack (1), Sangyoon Han (2), Ming C. Wu (3)
1 : Postdoctoral Fellow at UC Berkeley, 253M Cory Hall, Berkeley, CA, 94720-1770, quack@eecs.berkeley.edu
2 : UC Berkeley, sangyoon@eecs.berkeley.edu, 3 : UC Berkeley, wu@eecs.berkeley.edu

Abstract: An AlGe eutectic wafer level bonding process is presented and characterized for heterogeneous integration of silicon photonics, CMOS integrated electronic circuits and active III-V components.

This paper details a process for eutectic bonding of photonic and electronic chips, developed at Stanford SNF in cooperation with the Marvel Lab at UCB. This paper was presented at  International Nano-Optoelectronics Workshop

Paper

 

 

Tags: 
wafer bonding
SNF
Stanford
eutectic bonding

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