Technical Liaisons
The NNIN Technical Liaisons are a subset of the NNIN with highly specialized skills or advanced academic training in particular areas. They are often published Ph.D. level scientists who can be a particularly useful resource as you develop your project or as you run into particular processing issues. Please feel free to contact them.
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Name |
Contact | Expertise and Special Interests | |
|---|---|---|---|
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Alpha, Chris Cornell University Process Engineer |
alpha@cnf.cornell.edu 607-254-4913 |
Photolithography, electroplating, CMP, Molecular Vapor Deposition |
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Antoniou, Nicholas Harvard University Principal FIB Engineer |
nicholas@cns.fas.harvard.edu 617-496-9682 |
Focused Ion Beam Milling for direct-write pattern generation, TEM sample preparation, cryogenic FIB-SEM, general sample prep and Imaging. |
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Beach, Katharine University of Michigan MEMS Domain Expert |
beach@umich.edu 734-255-9487 |
MEMS fabrication, Microfluidics, Process Integration, Design |
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Bleier, Alan Cornell University Research Associate |
bleier@cnf.cornell.edu 607 254-4931 |
Electron Beam Lithography; Optics; Process development for CNF users by Cornell grad student CNF Fellows; SEM; Energy Research Support. |
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Bojko, Rick University of Washington Sr. Research Engineer |
bojko@uw.edu 206-616-3534 |
Electron Beam Lithography and SEM |
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Bordonaro, Garry Cornell University Photolithography Engineer |
Bordonaro@cnf.cornell.edu 607-254-4936 |
Advanced Photolithography, including DUV |
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Borsa, Tomoko University of Colorado at Boulder Senior Scientist |
tomoko.borsa@colorado.edu 303-735-6815 |
Technical expertise in electron beam lithography, microscopy, general processing, deposition techniques and dry etching. |
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Braswell, Scott University of Washington Research Engineer |
sbras@uw.edu 206-685-6774 |
Transmission electron microscopy |
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Brown, Devin Georgia Institute of Technology Senior Research Engineer |
devin.brown@mirc.gatech.edu 404-385-4220 |
electron beam lithography and nanofabrication processes |
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Cibuzar, Greg University of Minnesota Lab Manager |
cibuzar@umn.edu 612-625-8079 |
MEMS process development |
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Clay, Noah Cornell University Process Integration Engineer |
clay@cnf.cornell.edu (607)-254-4309 |
Photolithography and thin film process integration |
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Cord, Brian M. University of Minnesota Research Associate |
bcord@umn.edu 612-626-3287 |
Electron beam lithography and electron microscopy |
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Craigg, Helene University of Michigan Geosciences Domain Expert |
helenec@umich.edu 734-615-9668 |
Geosciences, Environmental Sciences |
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Deal, Michael Stanford University Sr. Research Scientist and SNF Director of Education |
mdeal@stanford.edu 650-725-3607 |
Education Director for SNF. Also Senior Research Scientist specializing in advanced nanoelectronics materials science. |
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Drawl, William Pennsylvania State University Deposition Technical Lead |
wrd1@psu.edu 814 863 1326 |
Thin film deposition |
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Eichfeld, Chad Pennsylvania State University Nanolithography Research and Development Engineer |
cme133@psu.edu 814-865-8976 |
advanced nanolithography instruments and processes |
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Gehoski, Kathleen Pennsylvania State University Lithography Technical Lead |
kag31@psu.edu 814 865 7443 |
Photolithography |
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Genova, Vince Cornell University Process Engineer |
genova@cnf.cornell.edu (607) 254-4907 |
Reactive Ion Etching; MEMS; III-V device processing and advanced CMOS device processing; design of experiments |
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Gottfried, David Georgia Institute of Technology Senior Research Scientist |
dsgottfried@gatech.edu 404-894-0479 |
Surface functionalization and characterization; biomolecule and polymer deposition using ink-jet printing and other technologies; nanoparticle characterization; chemical and biological sensor development; |
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Hathaway, Mac Harvard University Senior Process Engineer |
hathaway@cns.fas.harvard.edu 617-495-9012 |
ALD, CVD, Safety, Wetbench and Chemical Safety, Toxic Gas Monitoring, Equipment Access Systems |
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Henderson, Walter Georgia Institute of Technology Research Scientist |
walter.henderson@gatech.edu 404-309-8023 |
Surface-science characterization techniques including XPS, Auger, SIMS/ToF-SIMS |
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Herrera-Fierro, Pilar C University of Michigan Surface Science Domain Expert |
pilarhf@umich.edu 734-646-1399 |
Surface Analysis, CMP, Electrochemistry, Metrology, AFM, SEM, Analytical Chemistry, Soft Lithography, Dip Pen Nanolithography |
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Hickman, Steven A. Harvard University Senior Photolithography Scientist |
shickman@cns.fas.harvard.edu 617-384-5024 |
Optical Lithography, MEMS/NEMS fabrication |
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Hixson, Leonard University of Washington Research Engineer |
lhixson@uw.edu 206-221-9358 |
Facility support |
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Hower, Robert W University of Michigan Biomedical MEMS Expert |
hower@umich.edu 734-827-4370 |
MEMS fabrication, Process Integration, Biomedical Sensors |
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Ilic, Rob Cornell University Research Associate |
rob@cnf.cornell.edu 607-254-4894 |
Process integration, Electron Beam and Optical Lithography for aggressively scaled dimensions, microscopy (eletron, optical, scanned probe), nanoscale characterization, Micro and nanomechanical structures, Fluid structure interactions, non-linear dynamics, nanomagnetics |
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Infante, Phil Cornell University Safety Manager and Silicon Process Engineer |
infante@cnf.cornell.edu 607-254-4926 |
CVD processes; lab safety |
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Joseph, Paul Georgia Institute of Technology Senior Research Scientist |
paul.joseph@mirc.gatech.edu 404-894-5029 |
Nanobiotechnology, Bio-MEMS, and Biosensors' applications such as Diagnostics and Detection systems. |
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Kosar, Turgut Fettah Harvard University Technical Manager, NanoMaterials Facilities |
fkosar@cns.fas.harvard.edu 617-495-1738 |
soft lithography, microfluidics, bioMEMS, micro-/nanofabrication, X-ray MicroCT |
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Lavalle, Guy Pennsylvania State University Etch Technical Lead |
gpl107@psu.edu 814 865 9339 |
Wet and dry etching |
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Lawler, Kris University of Washington Research Engineer |
kflawler@uw.edu 206-221-5821 |
Lithography |
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Lingley, Andrew University of Washington Research Engineer |
alingley@uw.edu 206-221-6349 |
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Magyari-Kope, Blanka Stanford University Computational Scientist |
blankamk@stanford.edu (650)-740-3921 |
Band structure and electronic transport effects of nanointerfaces between metallic, insulating, and semiconducting materials of novel and technologically relevant materials in metal gate/high-k MOS structures and nonvolatile memories. |
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Marti, James University of Minnesota Outreach Coordinator |
jmarti@umn.edu 612-626-0732 |
Formation and characterization of nano- and micron-scale particles. |
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McClelland, Arthur Harvard University Microscopy Scientist |
amcclelland@cns.fas.harvard.edu 617-496-8250 |
Advanced Microscopy |
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Mitchell, William J University of California at Santa Barbara Principal Development Engineer |
mitchell@ece.ucsb.edu 805-893-4974 |
Electron Beam Lithography/SEM/AFM/ALD |
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Mnaymneh, Khaled University of Michigan NNIN Outreach Coordinator |
kmnay@umich.edu 734-764-7077 |
III-V Semiconductors, Photonics, Mesoscopic Systems, Dispersion Engineering, Epitaxy and Quantum Systems |
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Myers, Ed |
edmyers@stanford.edu 650-725-4702 |
Process Integration |
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Myhajlenko, Stephan Arizona State University Associate Director, CSSER |
myhajlenko@asu.edu 480-965-2697 |
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Pakhomov, Alec University of Washington Lab Manager, NTUF |
pakhomov@uw.edu 206-616-2118 |
Expertise: Nanotechnology; materials characterization including XRD, Raman, ellipsometry, AFM; magnetic and electronic nanomaterials; spin electronics. |
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Palard, Maylene University of Texas at Austin Research Associate |
marylene@mer.utexas.edu 512-965-6671 |
Nanoimprint expert: mold making by E-beam lithography, imprinting, dry plasma transfer etch |
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Ray, Vishva P University of Michigan E-Beam Domain Expert |
vpray@umich.edu (734) 478-1747 |
E-beam Lithography, Nanofabrication, Biomedical sensors |
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Reynolds, Tom University of California at Santa Barbara Principal Development Engineer |
reynolds@ece.ucsb.edu 805-893-3918 |
lab management UCSB |
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Rhoades, Beth Cornell University Biological Devices Engineer and Research Associate |
rhoades@cnf.cornell.edu 607-254-4918 |
Microfluidics, Biosensors, Biological Applications of Nanotechnology |
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Schilling, Paul University of Washington Research Engineer |
schilp3@uw.edu 206-616-5725 |
chemical vapor deposition section, diffusion, and back end of line (BEOL) |
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Shiari, Behrouz University of Michigan Computational Scientist |
bshiari@umich.edu 734-615-4804 |
Modeling and simulation of micro/nanosytems (MEMS/NEMS, Micro/Nanofluidic Devices), Multiscale Modeling, Coupled Finite Element Analysis, Atomistic Simulations |
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Stewart, Derek Cornell University Computational Scientist |
stewart@cnf.cornell.edu (607) 255-2856 |
Predictive first principles approaches to model nanostructures and materials, electronic and thermal transport, and phonon and magnetic properties of materials. |
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Stopa, Michael Harvard University NNIN Computation Coordinator; Computational Scientist |
stopa@cns.fas.harvard.edu |
Mike is a computational physicist and material scientist specializing in transport in semiconductor heterostructures and the self-consistent electronic structure of quantum dots and nanowires. He is the Network Coordinator for Computation for NNIN. |
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Thibeault, Brian University of California at Santa Barbara Project Scientist |
thibeault@ece.ucsb.edu 805-893-2268 |
Advanced Processing; UCSB User Contact |
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Thomas, Mikkel Georgia Institute of Technology Research Engineer |
mikkel.thomas@nrc.gatech.edu 404-385-8536 |
Processing |
