Technical Liaisons
The NNIN Technical Liaisons are a subset of the NNIN with highly specialized skills or advanced academic training in particular areas. They are often published Ph.D. level scientists who can be a particularly useful resource as you develop your project or as you run into particular processing issues. Please feel free to contact them.
|
Name |
Contact | Expertise and Special Interests | |
|---|---|---|---|
|
Tresback, Jason S. Harvard University Senior Metrology Engineer |
jtresback@cns.fas.harvard.edu 617-496-1783 |
Metrology |
|
|
|
Tsakirgis, John Harvard University Senior Nanofabrication Engineer |
jtsakirg@cns.fas.harvard.ed 617-686-2939 |
CVD Processes |
|
|
Wallace, Paul University of Washington Research Engineer |
pwallace@uw.edu 206-685-6775 |
Optical and soft lithography, SEM, EBL, Confocal microscope, AFM, Raman, SPR, ellipsometry |
|
|
Westly, Daron Cornell University Process Engineer / Lab Use Manager/ |
westly@cnf.cornell.edu 607-254-4938 |
Electron Beam Lithography; Electroplating |
|
|
Zhang, Zhiyong Stanford University Computational Scientist |
zyzhang@stanford.edu 650-804-2856 |
Computational nanotechnology |
